Tin/Lead Solder

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The Chairman of Princeton Testing Laboratory, Bill Pickup, developed the first commercially available solder analysis program in 1967. At that time the technique used for determining impurity levels  was emission spectroscopy and Bill was co-author of the ASTM method. We still have the capability of emission spectroscopy and use it when required. However the Direct Reading Spectrograph takes care of impurities very efficiently and permits us to give even faster service. many times results are available the day following receipt of sample and always within two to three days. 

Tin is always done by iodimetric titration following ASTM:E-46.

    Both composition corrections and recommendations are given when requested. At typical report would look like the one given below. 

 

 
QUANTITATIVE ANALYSIS OF TIN, COPPER, AND GOLD SEMI-QUANTITATIVE ANALYSIS OF IMPURITIES
       
    Solder  Sample Concentrations %   
  Tin 61.93   
  Arsenic <.01  
  Antimony .32  
  Gold .015  
  Iron <.001  
  Nickel .003  
  Indium .001  
  Bismuth .031  
  Aluminum <.001  
  Copper .15  
  Silver .025  
  Zinc <.001  
  Cadmium <.001  
  Lead Balance  
       

 

For further information contact: bmcvp@ptltesting.com

 

 

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